Application

17704797 · CERAMIC ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE ARRANGEMENT, AND METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT

Filed 2022-03-25 · Granted · Patent 12068115 (2024-08-20) The official file ↗The patent and its PDF ↗ · Art unit 2847 · Examiner Harmandeep Singh · CPC H01G 4/30 · TAIYO YUDEN CO., LTD. · STEIN IP LLC

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

17.1 mo

to disposition 28.9 mo

Statutes raised

102 103

1 actions read

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