Application

17739215 · SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION AND VIA AND METHOD OF MANUFACTURING THE SAME

Filed 2022-05-09 · Granted · Patent 12211823 (2025-01-28) The official file ↗The patent and its PDF ↗ · Art unit 2817 · Examiner Tenley Hope Schofield Typical · CPC H10W 90/00 · Taiwan Semiconductor Manufacturing Company, Ltd. · JCIPRNET

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

19.3 mo

to disposition 32.7 mo

Statutes raised

103

1 actions read

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