Application

17745666 · SEMICONDUCTOR PACKAGE INCLUDING BUMP STRUCTURES WITH DIFFERENT SHAPES

Filed 2022-05-16 · Pending The official file ↗ · Art unit 2818 · Examiner Jaesun Lee Typical · CPC H10W 90/701 · SAMSUNG ELECTRONICS CO., LTD. · FISH & RICHARDSON P.C. (TC)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

24.5 mo

to disposition n/a

Statutes raised

103 112

2 actions read

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