Application

17757823 · PACKAGING OF THREE-DIMENSIONAL INTEGRATED CIRCUIT BY ENCAPSULATION WITH COPPER POSTS AND DOUBLE SIDED REDISTRIBUTION LAYER

Filed 2022-06-21 · Granted · Patent 12347763 (2025-07-01) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Douglas Anthony Yap Typical · CPC H10W 70/635 · ROCKLEY PHOTONICS LIMITED · Womble Bond Dickinson US LLP

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

27.4 mo

to disposition 36.3 mo

Statutes raised

102 103

1 actions read

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