Application

17810976 · SYSTEMS AND METHODS FOR ENHANCED WAFER MANUFACTURING

Filed 2022-07-06 · Granted · Patent 11846917 (2023-12-19) The official file ↗The patent and its PDF ↗ · Art unit 2115 · Examiner Ameir Myers Typical · CPC G05B 19/41875 · GlobalWafers Co., Ltd. · Patent Docket Department

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

12.9 mo

to disposition 17.4 mo

Statutes raised

0 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.