Application

17818308 · METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HIGH RESOLUTION

Filed 2022-08-08 · Granted · Patent 11697166 (2023-07-11) The official file ↗The patent and its PDF ↗ · Art unit 1712 · Examiner Francisco W Tschen Typical · CPC B23K 1/0016 · IO Tech Group Ltd. · Ascenda Law Group, PC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

5.2 mo

to disposition 11.1 mo

Statutes raised

103

1 actions read

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