Application
17847257 · PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS
Filed 2022-06-23 · Granted The official file ↗ · Art unit 2893 · Examiner Elias Ullah Easy · CPC H10W 70/685 · Intel Corporation · Akona IP PC - Intel
Office actions
2
first was Restriction requirement
RCEs
0
no appeal
To first action
38.5 mo
to disposition 49.9 mo
Statutes raised
102
1 actions read