Application

17861125 · ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY

Filed 2022-07-08 · Granted · Patent 11955434 (2024-04-09) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner David A Zarneke Typical · CPC H10W 74/014 · Intel Corporation · SCHWABE, WILLIAMSON & WYATT, P.C.

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

10.4 mo

to disposition 21.1 mo

Statutes raised

1 actions read

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