Application

17870847 · THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHOD OF FORMING THE SAME

Filed 2022-07-22 · Granted · Patent 11791333 (2023-10-17) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Mark Hatzilambrou Hard · CPC H10D 88/00 · Taiwan Semiconductor Manufacturing Company, Ltd. · JCIPRNET

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

4.8 mo

to disposition 14.9 mo

Statutes raised

103 112

1 actions read

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