Application

17884714 · Middle-Of-Line Interconnect Structure Having Air Gap And Method Of Fabrication Thereof

Filed 2022-08-10 · Granted · Patent 12142520 (2024-11-12) The official file ↗The patent and its PDF ↗ · Art unit 2898 · Examiner Farun Lu Typical · CPC H10W 20/40 · Taiwan Semiconductor Manufacturing Company, Ltd. · Haynes and Boone, LLP (24061)

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

19.5 mo

to disposition 27.1 mo

Statutes raised

0 actions read

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