PATLY.AIApplication
17911431 · LIQUID MOLDING COMPOUND FOR PROTECTING FIVE EDGES OF SEMICONDUCTOR CHIP AND PREPARATION METHOD THEREOF
Filed 2022-09-14 · Granted · Patent 11643499 (2023-05-09) The official file ↗The patent and its PDF ↗ · Art unit 2897 · Examiner Thinh T Nguyen Typical · CPC C08G 59/621 · HUBEI CHOICE TECHNOLOGY CO., LTD. · Bayramoglu Law Offices LLC
Office actions
1
first was Non-final rejection
RCEs
0
no appeal
To first action
4.8 mo
to disposition 7.8 mo
Statutes raised
103
2 actions read