Application

17942441 · WAFER CHUCK FOR A LASER BEAM WAFER DICING EQUIPMENT

Filed 2022-09-12 · Granted · Patent 12205842 (2025-01-21) The official file ↗The patent and its PDF ↗ · Art unit 2836 · Examiner Stephen W Jackson Easy · CPC H10P 72/0442 · Infineon Technologies AG · MURPHY, BILAK & HOMILLER/INFINEON TECHNOLOGIES

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

21.5 mo

to disposition 28.3 mo

Statutes raised

103

1 actions read

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