Application

17946450 · Method and Procedure for Miniaturing a Multi-layer PCB

Filed 2022-09-16 · Granted · Patent 11950361 (2024-04-02) The official file ↗The patent and its PDF ↗ · Art unit 2847 · Examiner Hoa Cao Nguyen Typical · CPC H05K 1/0298 · Veea Inc. · THE MARBURY LAW GROUP, PLLC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

4.3 mo

to disposition 18.5 mo

Statutes raised

102 103 112

2 actions read

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