PATLY.AIApplication
17972722 · MULTILAYER ELECTRONIC COMPONENT HAVING STRUCTURE FOR IMPROVED ADHESION FORCE AND MOISTURE PROTECTION
Filed 2022-10-25 · Granted · Patent 12354803 (2025-07-08) The official file ↗The patent and its PDF ↗ · Art unit 2848 · Examiner Daniel Michael Dubuisson Typical · CPC H01G 2/065 · SAMSUNG ELECTRO-MECHANICS CO., LTD. · Morgan, Lewis & Bockius LLP (WA)
Office actions
2
first was Non-final rejection
RCEs
0
no appeal
To first action
19.4 mo
to disposition 32.4 mo
Statutes raised
102 103 112
2 actions read