Application

17973132 · MULTILAYER ELECTRONIC COMPONENT

Filed 2022-10-25 · Granted · Patent 12224127 (2025-02-11) The official file ↗The patent and its PDF ↗ · Art unit 2848 · Examiner Michael P McFadden Typical · CPC H01G 4/2325 · SAMSUNG ELECTRO-MECHANICS CO., LTD. · Morgan, Lewis & Bockius LLP (WA)

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

16.4 mo

to disposition 27.6 mo

Statutes raised

102 103

1 actions read

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