Application

17977164 · SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Filed 2022-10-31 · Granted · Patent 12057434 (2024-08-06) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Marvin Payen Easy · CPC H10W 90/00 · Amkor Technology Singapore Holding Pte. Ltd. · Amkor Technology Singapore Holding Pte. Ltd.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

16.8 mo

to disposition 21.2 mo

Statutes raised

0 actions read

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