Application

17994784 · PACKAGING FOR MICROLEDS FOR CHIP TO CHIP COMMUNICATION

Filed 2022-11-28 · Granted · Patent 11835758 (2023-12-05) The official file ↗The patent and its PDF ↗ · Art unit 2874 · Examiner Ellen E Kim Typical · CPC G02B 6/12004 · AvicenaTech Corp. · AvicenaTech, Corp.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

3.8 mo

to disposition 12.2 mo

Statutes raised

103 112

1 actions read

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