Application

18011837 · SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE

Filed 2022-12-22 · Granted · Patent 12672492 (2026-06-30) The official file ↗The patent and its PDF ↗ · Art unit 1713 · Examiner Binh X Tran Typical · CPC H10P 50/283 · Lam Research Corporation · Polygon IP, LLP / Lam Research

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

30.4 mo

to disposition 42.3 mo

Statutes raised

103 112

1 actions read

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