Application

18032797 · INTERSPERSED FLUIDIC ELEMENTS AND CIRCUIT ELEMENTS IN A FLUIDIC DIE

Filed 2023-04-19 · Granted · Patent 12257837 (2025-03-25) The official file ↗The patent and its PDF ↗ · Art unit 2853 · Examiner Lisa Solomon Easy · CPC B41J 2/1404 · Hewlett-Packard Development Company, L.P. · Foley & Lardner LLP / HP Inc.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

20.8 mo

to disposition 23.2 mo

Statutes raised

0 actions read

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