Application
18035343 · 3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESION BETWEEN COPPER AND GLASS SURFACES AND ARTICLES THEREFROM
Filed 2023-05-04 · Abandoned The official file ↗ · Art unit 1781 · Examiner Jeffrey A Vonch Typical · CPC H10W 70/095 · CORNING INCORPORATED · CORNING INCORPORATED
Office actions
1
first was Restriction requirement
RCEs
0
no appeal
To first action
21.7 mo
to disposition 29.5 mo
Statutes raised
102 103
1 actions read