Application

18048513 · Solder Ball Application for Singular Die

Filed 2022-10-21 · Granted · Patent 11978711 (2024-05-07) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Wilner Jean Baptiste Typical · CPC H10W 72/90 · Global Circuit Innovations Inc. · Global Circuit Innovations Incorporated

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

16.5 mo

to disposition 18.5 mo

Statutes raised

1 actions read

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