Application

18049143 · DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

Filed 2022-10-24 · Granted · Patent 12266598 (2025-04-01) The official file ↗The patent and its PDF ↗ · Art unit 2847 · Examiner Ishwarbhai B Patel Hard · CPC H10W 70/685 · International Business Machines Corporation · INACTIVE - Patterson & Sheridan, LLP /IBM ROC/AUS

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

20.6 mo

to disposition 29.2 mo

Statutes raised

1 actions read

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