Application

18053264 · Method and Procedure for Miniaturing a Multi-layer PCB

Filed 2022-11-07 · Granted · Patent 12150237 (2024-11-19) The official file ↗The patent and its PDF ↗ · Art unit 2847 · Examiner Hoa Cao Nguyen Typical · CPC H05K 1/0206 · Veea Inc. · THE MARBURY LAW GROUP, PLLC

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

21.4 mo

to disposition 24.4 mo

Statutes raised

0 actions read

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