Application

18064341 · Interconnect Structure Having a Carbon-Containing Barrier Layer

Filed 2022-12-12 · Granted · Patent 11908697 (2024-02-20) The official file ↗The patent and its PDF ↗ · Art unit 2892 · Examiner Hoai V Pham Easy · CPC H10P 14/43 · Taiwan Semiconductor Manufacturing Co., Ltd. · Taiwan Semiconductor Manufacturing Co., Ltd.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

5.7 mo

to disposition 14.3 mo

Statutes raised

1 actions read

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