Application

18083554 · THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING

Filed 2022-12-18 · Granted · Patent 12702004 (2026-08-04) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Peniel M Gumedzoe Typical · CPC H10W 40/47 · International Business Machines Corporation · INTERNATIONAL BUSINESS MACHINES CORPORATION

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

28.3 mo

to disposition 43.5 mo

Statutes raised

103

2 actions read

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