Application

18085037 · MULTILAYER ELECTRONIC COMPONENT

Filed 2022-12-20 · Granted · Patent 12278056 (2025-04-15) The official file ↗The patent and its PDF ↗ · Art unit 2848 · Examiner Eric W Thomas Typical · CPC H01G 4/1209 · SAMSUNG ELECTRO-MECHANICS CO., LTD. · Morgan, Lewis & Bockius LLP (WA)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

18.8 mo

to disposition 27.8 mo

Statutes raised

103 112

1 actions read

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