Application

18089213 · LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

Filed 2022-12-27 · Granted · Patent 11984396 (2024-05-14) The official file ↗The patent and its PDF ↗ · Art unit 2813 · Examiner Hoa B Trinh Typical · CPC H10W 20/42 · Intel Corporation · SCHWABE, WILLIAMSON & WYATT, P.C.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

12.9 mo

to disposition 16.6 mo

Statutes raised

0 actions read

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