Application

18089732 · Structures and Processes for Void-Free Hybrid Bonding

Filed 2022-12-28 · Granted · Patent 12456709 (2025-10-28) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Mohammad M Choudhry Typical · CPC H10P 72/78 · International Business Machines Corporation · IBM CORPORATION - PATENTS+ TEAM

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

28.1 mo

to disposition 34.0 mo

Statutes raised

0 actions read

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