Application

18109291 · MULTI-DIMENSIONAL PHOTONIC INTEGRATED CIRCUITS AND MEMORY STRUCTURE HAVING OPTICAL COMPONENTS MOUNTED ON MULTIPLE PLANES OF A MULTI-DIMENSIONAL PACKAGE

Filed 2023-02-14 · Granted · Patent 11862736 (2024-01-02) The official file ↗The patent and its PDF ↗ · Art unit 2897 · Examiner Alonzo Chambliss Typical · CPC H10F 77/955 · GBT Technologies Inc. · Eric L. Lane

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

2.6 mo

to disposition 10.6 mo

Statutes raised

112 DP

1 actions read

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