Application
18125620 · TECHNIQUES FOR ASSEMBLING "LIDAR ON A CHIP" TO MINIMIZE MECHANICAL VOLUME
Filed 2023-03-23 · Pending The official file ↗ · Art unit 3645 · Examiner Aviraj Dongsook Singh · CPC G01S 7/481 · AEVA, INC. · WOMBLE BOND DICKINSON (US) LLP /Aeva
Office actions
2
first was Non-final rejection
RCEs
0
no appeal
To first action
35.5 mo
to disposition n/a
Statutes raised
103
2 actions read