Application

18136708 · METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

Filed 2023-04-19 · Abandoned The official file ↗ · Art unit 2893 · Examiner Victor V Barzykin Typical · CPC H10P 54/00 · Plasma-Therm LLC · HARVEY S. KAUGET

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

25.8 mo

to disposition 34.2 mo

Statutes raised

102 103 112 DP

1 actions read

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