Application

18160124 · Method and Apparatus for Use in Wafer Processing

Filed 2023-01-26 · Granted · Patent 12148640 (2024-11-19) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Julia Slutsker Typical · CPC H10P 72/0606 · Infineon Technologies AG · SLATER MATSIL, LLP/INFINEON

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

11.5 mo

to disposition 21.8 mo

Statutes raised

102 103 DP

2 actions read

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