Application

18181020 · SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

Filed 2023-03-09 · Granted · Patent 12142474 (2024-11-12) The official file ↗The patent and its PDF ↗ · Art unit 1714 · Examiner Douglas Lee Typical · CPC H10P 70/23 · Tokyo Electron Limited · Pearne & Gordon LLP

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

14.3 mo

to disposition 20.2 mo

Statutes raised

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