Application
18211455 · SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING
Filed 2023-06-19 · Pending The official file ↗ · Art unit 2811 · Examiner Samuel A Gebremariam Easy · CPC H10W 90/701 · Intel Corporation · SCHWEGMAN LUNDBERG & WOESSNER/Intel
Office actions
1
first was Restriction requirement
RCEs
0
no appeal
To first action
36.8 mo
to disposition n/a
Statutes raised
102 112
1 actions read