Application

18213806 · METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

Filed 2023-06-23 · Pending The official file ↗ · Art unit 2898 · Examiner Erik T Peterson Typical · CPC H01J 37/32715 · Plasma-Therm LLC · HARVEY S. KAUGET

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

33.3 mo

to disposition n/a

Statutes raised

103

1 actions read

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