PATLY.AIApplication
18233790 · Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate
Filed 2023-08-14 · Granted · Patent 12165895 (2024-12-10) The official file ↗The patent and its PDF ↗ · Art unit 3729 · Examiner Thiem D Phan Easy · CPC H10P 72/0442 · Rohinni, Inc. · Lee & Hayes P.C. / Rohinni (Cowles)
Office actions
1
first was Non-final rejection
RCEs
0
no appeal
To first action
6.7 mo
to disposition 15.9 mo
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