Application

18337975 · PACKAGE MODULE WITH A PLURALITY OF STACKED SUBSTRATES HAVING MULTIPLE POWER CHIPS

Filed 2023-06-20 · Granted The official file ↗ · Art unit 2897 · Examiner Alonzo Chambliss Typical · CPC H10W 40/47 · BYD SEMICONDUCTOR COMPANY LIMITED · Anova Law Group, PLLC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

32.1 mo

to disposition 36.6 mo

Statutes raised

102

1 actions read

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