Application

18369652 · SEMICONDUCTOR DEVICE WITH ELECTRICAL COMPONENT FOR BRIDGING LEADFRAME AND CHIP MOUNTING PORTION AND CORRESPONDING METHOD OF MANUFACTURE

Filed 2023-09-18 · Granted · Patent 12300585 (2025-05-13) The official file ↗The patent and its PDF ↗ · Art unit 2893 · Examiner Suberr L Chi Typical · CPC H10W 70/465 · STMicroelectronics S.r.l. · CROWE & DUNLEVY - ST

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

9.8 mo

to disposition 19.8 mo

Statutes raised

102 112

1 actions read

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