Application

18402563 · METHOD OF BREAKING THROUGH ETCH STOP LAYER

Filed 2024-01-02 · Granted · Patent 12381081 (2025-08-05) The official file ↗The patent and its PDF ↗ · Art unit 2893 · Examiner Vicki B Booker Typical · CPC H10D 84/0193 · Taiwan Semiconductor Manufacturing Co., Ltd. · Taiwan Semiconductor Manufacturing Co., Ltd.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

14.7 mo

to disposition 19.1 mo

Statutes raised

0 actions read

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