Application

18420686 · PACKAGE STRUCTURE

Filed 2024-01-23 · Granted · Patent 12283556 (2025-04-22) The official file ↗The patent and its PDF ↗ · Art unit 2811 · Examiner Nitin Parekh Easy · CPC H10W 90/00 · Taiwan Semiconductor Manufacturing Company, Ltd. · TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

7.2 mo

to disposition 14.9 mo

Statutes raised

112

1 actions read

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