Application

18429677 · Integrated Assemblies and Methods of Forming Integrated Assemblies

Filed 2024-02-01 · Granted · Patent 12250825 (2025-03-11) The official file ↗The patent and its PDF ↗ · Art unit 2827 · Examiner Tan Nguyen Easy · CPC H10B 53/50 · Micron Technology, Inc. · Wells St. John, P.S.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

9.1 mo

to disposition 13.3 mo

Statutes raised

0 actions read

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