PATLY.AIApplication
18430600 · CHIP PACKAGING STRUCTURE
Filed 2024-02-01 · Granted The official file ↗ · Art unit 2891 · Examiner David A Zarneke Typical · CPC H10W 44/20 · Chengdu Sicore Semiconductor Corp. Ltd. · NORTH WEBER & BAUGH
Office actions
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first was Restriction requirement
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no appeal
To first action
26.4 mo
to disposition 29.9 mo
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