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Application

18434698 · PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

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Filed 2024-02-06 · Granted · Patent 12581952 (2026-03-17) The official file ↗The patent and its PDF ↗ · Art unit 2817 · Examiner Marlon T Fletcher Typical · CPC H10W 74/121 · Advanced Semiconductor Engineering, Inc. · FOLEY & LARDNER LLP

Office actions
2
first was Restriction requirement
RCEs
0
no appeal
To first action
8.3 mo
to disposition 25.3 mo
Statutes raised
102 103 112 DP
2 actions read
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