Application

18435915 · METHOD FOR MANUFACTURING LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS

Filed 2024-02-07 · Granted · Patent 12255076 (2025-03-18) The official file ↗The patent and its PDF ↗ · Art unit 2898 · Examiner Shouxiang Hu Typical · CPC H10W 74/114 · STMICROELECTRONICS, INC. · Seed IP Law Group LLP/STMicroelectronics

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

7.1 mo

to disposition 13.3 mo

Statutes raised

0 actions read

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