PATLY.AIApplication
18450373 · METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
Filed 2023-08-15 · Granted · Patent 12154885 (2024-11-26) The official file ↗The patent and its PDF ↗ · Art unit 2898 · Examiner Robert G Bachner Typical · CPC H10W 72/0198 · EPISTAR CORPORATION · Huan-Yi Lin
Office actions
1
first was Non-final rejection
RCEs
0
no appeal
To first action
6.9 mo
to disposition 15.4 mo
Statutes raised
103
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