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Application

18504136 · SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

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Filed 2023-11-07 · Granted · Patent 12218001 (2025-02-04) The official file ↗The patent and its PDF ↗ · Art unit 2811 · Examiner Nitin Parekh Easy · CPC H10W 20/084 · Taiwan Semiconductor Manufacturing Company, Ltd. · JCIPRNET

Office actions
1
first was Non-final rejection
RCEs
0
no appeal
To first action
7.2 mo
to disposition 14.9 mo
Statutes raised
112
1 actions read
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