Application

18526591 · THERMAL INTERFACE MATERIAL, AN INTEGRATED CIRCUIT FORMED THEREWITH, AND A METHOD OF APPLICATION THEREOF

Filed 2023-12-01 · Granted · Patent 12027442 (2024-07-02) The official file ↗The patent and its PDF ↗ · Art unit 1762 · Examiner Hui H Chin Typical · CPC H10W 40/257 · Arieca Inc. · K&L GATES LLP-Pittsburgh

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

1.8 mo

to disposition 7.0 mo

Statutes raised

103

1 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.