Application

18531561 · SEMICONDUCTOR DEVICE HAVING CAVITIES AT AN INTERFACE OF AN ENCAPSULANT AND A DIE PAD OR LEADS

Filed 2023-12-06 · Granted · Patent 12224251 (2025-02-11) The official file ↗The patent and its PDF ↗ · Art unit 2811 · Examiner Nitin Parekh Easy · CPC H10W 74/111 · STMicroelectronics, Inc. · Seed IP Law Group LLP/STMicroelectronics

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

6.7 mo

to disposition 14.2 mo

Statutes raised

102 103

1 actions read

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