Application

18594007 · METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS

Filed 2024-03-04 · Granted · Patent 12519078 (2026-01-06) The official file ↗The patent and its PDF ↗ · Art unit 1735 · Examiner Kiley Shawn Stoner Easy · CPC H10P 72/0428 · NCC NANO, LLC · STINSON LLP

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

13.4 mo

to disposition 22.1 mo

Statutes raised

103 112

1 actions read

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