Application

18596488 · ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY

Filed 2024-03-05 · Granted · Patent 12525544 (2026-01-13) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner David A Zarneke Typical · CPC H10W 74/014 · Intel Corporation · SCHWABE, WILLIAMSON & WYATT, P.C.

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

12.5 mo

to disposition 22.3 mo

Statutes raised

1 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.